Current: Physical Electronics and Integrated Circuits

Program Requirements

All EECS MEng students should expect to complete four (4) technical courses within the EECS department at the graduate level, the Fung Institute's engineering leadership curriculum, as well as a capstone project that will be hosted by the EECS department. You must select a project from the list below.

2018-2019 Capstone Design Experience

IoT System-on-Chip (advisor Prof. Kristofer Pister)

Description - The Internet of Things System on Chip Design experience is a combination of an introductory class in analog (EE240A) or digital (EECS251A) design coupled with an advanced Capstone Project class in the Spring term. The Capstone Project class will focus on the design and implementation of a single-chip wireless sensor node for the Internet of Things. The chip will include a 32 bit RISC-V processor and memory, 2.4 GHz radio transceiver, energy scavenging interface, power management, on-board sensors, and sensor interfaces. Another exciting aspect of the class is that the goal is to submit the design for fabrication in 28nm or 45nm CMOS process at the end of the semester, which means that the students will get exposure working with realistic design kits and design flows.

One or more teams of students will divide the project into modules and work together to design and integrate the modules into a single chip. Topics include: Analog/RF mixed-signal, ASIC toolchain: layout, synthesis, extraction, verfication; design for test; matlab system modeling; interface design; floorplanning; system simulation.

2018-2019 Capstone Projects

For the capstone projects for Master of Engineering in Electrical Engineering and Computer Science (EECS) our department believes that the students are going to have a significantly better experience if the projects are followed closely by an EECS professor throughout the academic year. To ensure this, we have asked the faculty in each area for which the Master of Engineering is offered in our department to formulate one or more project ideas that the incoming students will have to choose from.

Technical Courses

At least three of your four technical courses should be chosen from the list below. The remaining technical courses should be chosen from your own or another MEng area of concentration within the EECS Department.

Fall 2018

Spring 2019 (updated as of 10/16/2018)

  • EE 213A, Power Electronics
  • EE 219C, Computer Aided Verification
  • EE C220A, Advanced Control Systems
  • EE 225B, Digital Image Processing
  • EE 230A, Integrated-Circuits Devices
  • EE 230B, Solid State Devices
  • EE 240B, Advanced Analog Integrated Circuits
  • EE 247B, Introduction to MEMS Design
  • EE 249B, Design of Embedded Systems: Models, Validation, Synthesis
  • EECS 251A, Introduction to Digital Design and Integrated Circuits 
    • Pick ONE accompanying lab section below:
      • EECS 251AL, Application Specific Integrated Circuits Laboratory
      • EECS 251BL, FPGA Design Laboratory
  • EE 290C, Advanced Topics in Bioelectronics
  • EE 290T,  Advanced Topics in Signal Processing

Note: The courses listed here are not guaranteed to be offered, and the course schedule may change without notice. Refer to the UC Berkeley Course Schedule for further enrollment information.